EXPERIMENTAL AND CALCULATED RADIAL PRESSURE-GRADIENTS IN REACTIVE SPUTTER PROCESSES

被引：3

作者：

VANZON, JBAD

RIJPERS, JCN

机构：

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A | 1989年 / 7卷 / 02期

关键词：

D O I：

10.1116/1.575743

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

引用

页码：144 / 150

页数：7

共 16 条

[1] DEPOSITION RATE OF METALLIC THIN-FILMS IN REACTIVE SPUTTERING PROCESS [J].

ABE, T ;

YAMASHINA, T .

THIN SOLID FILMS, 1975, 30 (01) :19-27

[2] MECHANISMS OF VOLTAGE-CONTROLLED, REACTIVE, PLANAR MAGNETRON SPUTTERING OF AL IN AR-N2 AND AR-O2 ATMOSPHERES [J].

AFFINITO, J ;

PARSONS, RR .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 1984, 2 (03) :1275-1284

[3] MODELING OF REACTIVE SPUTTERING OF COMPOUND MATERIALS [J].

BERG, S ;

BLOM, HO ;

LARSSON, T ;

NENDER, C .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1987, 5 (02) :202-207

[4]

DANROC J, 1987, P INT S TRENDS NEW A, V1, P347

[5]

DUSHMAN S, 1949, SCI F VACUUM TECHNIQ, P36

[6]

FROMM E, 1976, VAKUUM-TECH, V25, P163

[7] REACTIVE SPUTTERING OF METALS IN OXIDIZING ATMOSPHERES [J].

HELLER, J .

THIN SOLID FILMS, 1973, 7 (02) :163-176

[8] PARTIAL-PRESSURE CONTROL OF REACTIVELY SPUTTERED TITANIUM NITRIDE [J].

HMIEL, AF .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1985, 3 (03) :592-595

[9] REACTIVE SPUTTER DEPOSITION - A QUANTITATIVE-ANALYSIS [J].

HOHNKE, DK ;

SCHMATZ, DJ ;

HURLEY, MD .

THIN SOLID FILMS, 1984, 118 (03) :301-310

[10] SPUTTERING OF METALS IN PRESENCE OF REACTIVE GASES [J].

HRBEK, J .

THIN SOLID FILMS, 1977, 42 (02) :185-191

← 1 2 →