ELECTROMIGRATION IN SPUTTERED AL-CU THIN-FILMS

被引：15

作者：

RODBELL, KP ^{[1
]}

SHATYNSKI, SR ^{[1
]}

机构：

[1] RENSSELAER POLYTECH INST,DEPT MAT ENGN,TROY,NY 12181

来源：

THIN SOLID FILMS | 1983年 / 108卷 / 01期

关键词：

D O I：

10.1016/0040-6090(83)90045-7

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：95 / 102

页数：8

共 32 条

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