REACTIONS BETWEEN TA-PT-TA-AU METALLIZATION AND PTSI OHMIC CONTACTS

被引：1

作者：

DAY, HM ^{[1
]}

CHRISTOU, A ^{[1
]}

WEISENBERGER, WH ^{[1
]}

HIRVONEN, JK ^{[1
]}

机构：

[1] USN RES LAB,WASHINGTON,DC 20375

来源：

JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 1975年 / 122卷 / 06期

关键词：

D O I：

10.1149/1.2134320

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

引用

页码：769 / 772

页数：4

共 19 条

[1] ELECTROMIGRATION-INDUCED FAILURES IN, AND MICROSTRUCTURE AND RESISTIVITY OF, SPUTTERED GOLD FILMS
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[2] STRUCTURE AND THERMAL-STABILITY OF SPUTTERED AU-TA FILMS
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[J]. JOURNAL OF APPLIED PHYSICS, 1973, 44 (08) : 3386 - 3393
[3] STABILIZED TANTALUM DIFFUSION BARRIER FOR GOLD METALLIZATION SYSTEM
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[4] RELIABILITY OF GOLD-STABILIZED TANTALUM METALLIZATIONS FOR MICROWAVE-POWER TRANSISTORS
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[J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1974, 121 (08) : 1076 - 1081
[5] PRINCIPLES AND APPLICATIONS OF ION-BEAM TECHNIQUES FOR ANALYSIS OF SOLIDS AND THIN-FILMS
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[J]. THIN SOLID FILMS, 1973, 17 (01) : 1 - 41
[6] SEEMAN-BOHLIN X-RAY DIFFRACTOMETER FOR THIN FILMS
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BERRY, BS
[J]. JOURNAL OF APPLIED CRYSTALLOGRAPHY, 1970, 3 (OCT1) : 372 - &
[7] A NEW ETCHANT FOR THIN FILMS OF TANTALUM AND TANTALUM COMPOUNDS
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HERMAN, DS
[J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1969, 116 (05) : 674 - &
[8] ELECTRICAL AND MECHANICAL FEATURES OF PLATINUM SILICIDE-ALUMINUM REACTION
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[J]. JOURNAL OF APPLIED PHYSICS, 1973, 44 (08) : 3476 - 3485
[9] ANALYSIS OF THIN-FILM STRUCTURES WITH NUCLEAR BACKSCATTERING AND X-RAY-DIFFRACTION
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TU, KN
[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1974, 11 (01): : 86 - 93
[10] MICROANALYSIS OF MATERIALS BY BACKSCATTERING SPECTROMETRY
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MITCHELL, IV
MAYER, JW
[J]. SCIENCE, 1972, 177 (4052) : 841 - &

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