Ultrathin metal-oxide-semiconductor (MOS) gate dielectrics have been fabricated by conventional thermal oxidation of Si in pure N2O ambient. Electrical results show that gate dielectrics prepared by this method exhibit comparable fixed charge density compared to control SiO2, but significantly reduced interface state generation and charge trapping under constant current stressing. A nitrogen incorporation at the Si/SiO2 interface is observed and suggested to be responsible for the improved characteristics.