LASER ABLATION DEPOSITION OF TITANIUM NITRIDE FILMS ON SILICON SUBSTRATES AT ROOM-TEMPERATURE

被引:12
作者
AUCIELLO, O
BARNES, T
CHEVACHAROENKUL, S
SCHREINER, AF
MCGUIRE, GE
机构
[1] N CAROLINA STATE UNIV,DEPT MAT SCI & ENGN,RALEIGH,NC 27695
[2] N CAROLINA STATE UNIV,DEPT CHEM,RALEIGH,NC 27695
关键词
D O I
10.1016/0040-6090(89)90473-2
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
引用
收藏
页码:65 / 73
页数:9
相关论文
共 21 条
[1]   INVESTIGATION OF TIN FILMS REACTIVELY SPUTTERED USING A SPUTTER GUN [J].
AHN, KY ;
WITTMER, M ;
TING, CY .
THIN SOLID FILMS, 1983, 107 (01) :45-54
[2]   SURFACE COMPOSITIONAL AND TOPOGRAPHICAL CHANGES RESULTING FROM EXCIMER LASER IMPACTING ON YBA2CU3O7 SINGLE-PHASE SUPERCONDUCTORS [J].
AUCIELLO, O ;
KRAUSS, AR ;
SANTIAGOAVILES, J ;
SCHREINER, AF ;
GRUEN, DM .
APPLIED PHYSICS LETTERS, 1988, 52 (03) :239-241
[3]   TIN COATINGS ON STEEL [J].
BUHL, R ;
PULKER, HK ;
MOLL, E .
THIN SOLID FILMS, 1981, 80 (1-3) :265-270
[4]  
Calvert J. G., 1966, PHOTOCHEMISTRY
[5]   MICROHARDNESS OF TINX COATINGS OBTAINED BY REACTIVE CATHODIC SPUTTERING [J].
CHEVALLIER, J ;
CHABERT, JP .
THIN SOLID FILMS, 1981, 80 (1-3) :263-263
[6]   REACTIVE ION PLATING (RIP) WITH AUXILIARY DISCHARGE AND THE INFLUENCE OF THE DEPOSITION CONDITIONS ON THE FORMATION AND PROPERTIES OF TIN FILMS [J].
FLEISCHER, W ;
SCHULZE, D ;
WILBERG, R ;
LUNK, A ;
SCHRADE, F .
THIN SOLID FILMS, 1979, 63 (02) :347-356
[7]   EFFECTS OF SUBSTRATE-TEMPERATURE AND SUBSTRATE MATERIAL ON THE STRUCTURE OF REACTIVELY SPUTTERED TIN FILMS [J].
HIBBS, MK ;
JOHANSSON, BO ;
SUNDGREN, JE ;
HELMERSSON, U .
THIN SOLID FILMS, 1984, 122 (02) :115-129
[8]   THE EFFECTS OF SUBSTRATE BIAS ON THE STRUCTURAL AND ELECTRICAL-PROPERTIES OF TIN FILMS PREPARED BY REACTIVE RF SPUTTERING [J].
IGASAKI, Y ;
MITSUHASHI, H .
THIN SOLID FILMS, 1980, 70 (01) :17-25
[9]   MICROSTRUCTURES OF TIN AND TI2N DEPOSITS PREPARED BY ACTIVATED REACTIVE EVAPORATION [J].
JACOBSON, BE ;
NIMMAGADDA, R ;
BUNSHAH, RF .
THIN SOLID FILMS, 1979, 63 (02) :333-339
[10]   THE DEPOSITION RATE AND PROPERTIES OF THE DEPOSIT IN PLASMA ENHANCED CHEMICAL VAPOR-DEPOSITION OF TIN [J].
JANG, DH ;
CHUN, JS ;
KIM, JG .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1989, 7 (01) :31-35