ADHESION AND INTERNAL-STRESS IN THIN-FILMS OF ALUMINUM

被引：23

作者：

LAUGIER, M

机构：

来源：

THIN SOLID FILMS | 1981年 / 79卷 / 01期

关键词：

D O I：

10.1016/0040-6090(81)90423-5

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：15 / 19

页数：5

共 10 条

[1] EFFECT OF IMPURITIES ON INTRINSIC STRESS IN THIN NI FILMS [J].

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HOFFMAN, RW .

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[3] MEASUREMENT OF ADHESION OF THIN FILMS [J].

BENJAMIN, P ;

WEAVER, C .

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[5] INTRINSIC STRESS IN EVAPORATED METAL FILMS [J].

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[6] THE CONSTRUCTION AND USE OF THIN-FILM THERMOCOUPLES FOR THE MEASUREMENT OF SURFACE-TEMPERATURE - APPLICATIONS TO SUBSTRATE-TEMPERATURE DETERMINATION AND THERMAL BENDING OF A CANTILEVERED PLATE DURING FILM DEPOSITION [J].

LAUGIER, M .

THIN SOLID FILMS, 1980, 67 (01) :163-170

[7] ANALYSIS OF SUBSTRATE BENDING DURING EVAPORATION OF THIN-FILMS DUE TO A SMALL TEMPERATURE DIFFERENCE BETWEEN THE SUBSTRATE FACES [J].

LAUGIER, M .

THIN SOLID FILMS, 1980, 66 (02) :L11-L14

[8] MEASUREMENT OF THE INTRINSIC STRESS IN THIN-FILMS OF SILVER BY A NEW CANTILEVERED PLATE TECHNIQUE [J].

LAUGIER, M .

THIN SOLID FILMS, 1981, 75 (03) :213-219

[9] INTRINSIC STRESS IN THIN-FILMS OF AG, AL, ZNS AND LIF [J].

LAUGIER, M .

JOURNAL OF MATERIALS SCIENCE, 1980, 15 (05) :1147-1152

[10] ANALYSIS OF THE CANTILEVERED PLATE METHOD OF THIN-FILM INTRINSIC STRESS DETERMINATION [J].

LAUGIER, M .

THIN SOLID FILMS, 1980, 66 (02) :L7-L10

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