Control of selective tungsten chemical vapor deposition by monolayer nitridation of silicon surface

被引:3
作者
Takami, S
Saito, T
Fujii, M
Egashira, Y
Komiyama, H
机构
[1] Dept. of Chemical System Engineering, Faculty of Engineering, University of Tokyo, Bunkyo-ku, Tokyo 113
[2] Dept. of Chem. Sci. and Technology, Kyushu University, Fukuoka-shi
关键词
D O I
10.1149/1.1836450
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
Selective tungsten chemical vapor deposition was carried out on three kinds of substrates: hydrogen-terminated silicon (H-SI), monolayer nitrided silicon (N-Si), and thermally grown silicon oxide. X-ray photoelectron spectroscopy (XPS) confirmed that the H-SI substrates differ from the N-Si substrates only by the monolayer of nitride on their surface. Field-emission scanning electron spectroscopy and XPS showed that tungsten does not deposit on the N-Si substrates but does deposit on the H-SI substrates. Monolayer nitridation therefore has the potential for improving and optimizing the thin-film preparation processes, because it provides a means for altering the surface reactivity while keeping the bulk properties unchanged.
引用
收藏
页码:L38 / L40
页数:3
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