AL/TIW REACTION-KINETICS - INFLUENCE OF CU AND INTERFACE OXIDES

被引：24

作者：

OLOWOLAFE, JO ^{[1
]}

PALMSTROM, CJ ^{[1
]}

COLGAN, EG ^{[1
]}

MAYER, JW ^{[1
]}

机构：

[1] CORNELL UNIV,DEPT MAT SCI & ENGN,ITHACA,NY 14853

来源：

JOURNAL OF APPLIED PHYSICS | 1985年 / 58卷 / 09期

关键词：

D O I：

10.1063/1.335764

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：3440 / 3443

页数：4

共 20 条

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[4] ELECTRICAL DEGRADATION OF N-SI/PTSI/(TI-W)/AL SCHOTTKY CONTACTS INDUCED BY THERMAL TREATMENTS
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[J]. THIN SOLID FILMS, 1982, 97 (04) : 325 - 331
[5] A STUDY OF VANADIUM AS DIFFUSION BARRIER BETWEEN ALUMINUM AND GADOLINIUM SILICIDE CONTACTS
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[J]. JOURNAL OF APPLIED PHYSICS, 1982, 53 (10) : 6891 - 6897
[6] STUDY OF AL-PD2SI CONTACTS ON SI
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[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1977, 14 (01): : 75 - 78
[7] MATERIAL REACTIONS AL/PD2SI/SI JUNCTIONS .2. KINETIC RATES
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[J]. JOURNAL OF APPLIED PHYSICS, 1982, 53 (11) : 7445 - 7449
[8] HOSACK HH, 1973, J APPL PHYS, V44, P8
[9] KINETICS OF COMPOUND FORMATION IN THIN-FILM COUPLES OF AL AND TRANSITION-METALS
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HO, PS
[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1976, 13 (01): : 68 - 71
[10] INFLUENCE OF CU AS AN IMPURITY IN AL/TI AND AL/W THIN-FILM REACTIONS
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PALMSTROM, CJ
MAYER, JW
[J]. APPLIED PHYSICS LETTERS, 1983, 43 (11) : 1015 - 1017

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